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Environmental Reports

All IP5000 part numbers

Applies to env reports:
  • ABLEBOND® 2000 Adhesive
  • KE-G2250 Molding Compound
  • PBGA IC Substrate
  • Solder Balls
  • Sumitomo Gold Bonding Wire
  • Teca-Print TPC-410 Pad Printing Ink

ASE IP2022/PQ80-120U units with datecode 25BG

Applies to env reports:
  • Gold Bonding Wire MGFL1-B
  • Lead Finish Pure Tin
  • Lead Frame C7025
  • Mold Compound and Die Attach QFP
  • Teca-Print TPC-261 Marking Ink

Greatek IP2022/PQ80-120U units with datecode 25BK

Applies to env reports:
  • ABLEBOND® 8352L Adhesive
  • Gold Wire
  • Lead Frame C-7025
  • MARKEM® Series 4488 Pad Printing Ink
  • Pure Tin Pin Plating
  • Sumitomo Molding Compound

IP3000 processors with a "U" at the end of the part number

Applies to env reports:
  • ABLEBOND® 2000 Adhesive
  • KE-G2250 Molding Compound
  • PBGA IC Substrate
  • Solder Balls
  • Sumitomo Gold Bonding Wire
  • Teca-Print TPC-410 Pad Printing Ink
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